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 DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
MBD128
BGA2011 900 MHz high linear low noise amplifier
Product specification Supersedes data of 2000 Sep 06 2000 Dec 04
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
FEATURES * Low current, low voltage * High linearity * High power gain * Low noise * Integrated temperature compensated biasing * Control pin for adjustment bias current. APPLICATIONS * RF front end * Low noise amplifiers, e.g. CDMA, PHs, Dect, etc. DESCRIPTION Silicon Monolitic Microwave Integrated Circuit (MMIC) amplifier consisting of an NPN double polysilicon transistor with integrated biasing for low voltage applications in a 6-pin SOT363 plastic SMD package.
handbook, halfpage
BGA2011
PINNING PIN 1 2 3 4 5, 6 RF in VC VS RF out GND DESCRIPTION
VS 5 4
6
RF out VC 1 2 3
MBL251
BIAS CIRCUIT
Top view
RF in
GND
Marking code:A5-
Fig.1 Simplified outline (SOT363) and symbol.
QUICK REFERENCE DATA SYMBOL VS IS IC |s21|2 NF PARAMETER DC supply voltage DC supply current DC control current insertion power gain noise figure VC = VS in application circuit, see Fig.2; f = 900 MHz IS = 15 mA; f = 900 MHz CONDITIONS RF input AC coupled 3 15 0.11 19 1.7 TYP. - - - - MAX. 4.5 UNIT V mA mA dB dB
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL VS VC IS IC Ptot Tstg Tj PARAMETER DC supply voltage voltage on control pin supply current control current total power dissipation storage temperature operating junction temperature Ts 100 C forced by DC voltage on RF input CONDITIONS RF input AC coupled - - - - - -65 - MIN. MAX. 4.5 VS 30 0.25 135 +150 150 UNIT V V mA mA mW C C
2000 Dec 04
2
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to solder point CONDITIONS Ptot = 135 mW; Ts 100 C VALUE 350
BGA2011
UNIT K/W
CHARACTERISTICS RF input AC coupled; VS = 3 V; IS = 15 mA; f = 900 MHz; Tj = 25 C; unless otherwise specified. SYMBOL IS IC RL IN PARAMETER supply current control current return losses input typical application; see Fig.2 high IP3 (see Fig.2; stripline = 0 mm) high IP3 (see Fig.2; stripline = 1.5 mm) RL OUT return losses output typical application; see Fig.2 high IP3 (see Fig.2; stripline = 0 mm) high IP3 (see Fig.2; stripline = 1.5 mm) |s21|2 insertion power gain typical application; see Fig.2 high IP3 (see Fig.2; stripline = 0 mm) high IP3 (see Fig.2; stripline = 1.5 mm) NF noise figure typical application; see Fig.2; IS = 15 mA high IP3 (see Fig.2; stripline = 0 mm) high IP3 (see Fig.2; stripline = 1.5 mm) IP3in input intercept point typical application; see Fig.2 high IP3 (see Fig.2; stripline = 0 mm) high IP3 (see Fig.2; stripline = 1.5 mm) CONDITIONS - - - - - - - - - - - - - - - - MIN. 10 TYP. 15 0.11 -11 -11 -17 -11 -12 -14 15 19 16 1.5 1.6 1.7 -2 4 10 MAX. 20 - - - - - - - - - - - - - - - - UNIT mA mA dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm
2000 Dec 04
3
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
APPLICATION INFORMATION
BGA2011
handbook, full pagewidth
VS VC VC C5 BIAS CIRCUIT
VS C4 L2 C2 C3
C1 RF in IN L1 C6 stripline SOT363
OUT
RF out
MLD480
GND
Fig.2 Application circuit.
List of components (see Fig.2) COMPONENT C1, C2 C3, C5 C4 C6 L1 L2 Note 1. The stripline (w = 0.7 mm) is on a gold plated double copper-clad printed-circuit board (r = 6.15), board thickness = 0.64 mm, copper thickness = 35 m, gold thickness = 5 m. DESCRIPTION multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor SMD inductor SMD inductor TYPICAL APPLICATION 100 pF 22 nF 5.6 pF - - - HIGH IP3 APPLICATION 100 pF 22 nF 5.6 pF 2 x 100 nF 10 nH 8.2 nH DIMENSIONS 0603 0603 0603 0805 0603 0603
2000 Dec 04
4
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
BGA2011
handbook, halfpage
30
MLD481
handbook, halfpage
20
MLD482
20 IS (mA)
gain (dB) 20
gain (dB) 15 Gmax 10 s21 2 IS s21 2 IS
15
10
10 5 5
0 0 1000 2000 f (MHz) 3000
0 0 1 2 VC (V) 3
0
IC = 15 mA; VS = VC = 3 V; PD = -30 dBm; Zo = 50 .
f = 900 MHz; VS = 3 V; PD = -30 dBm.
Fig.3
Insertion gain (|s21|2) and Gmax as functions of frequency; typical values.
Fig.4
Insertion gain and supply current as functions of control voltage; typical values.
handbook, halfpage s2
20
MLD483
handbook, halfpage
15
MLD484
0 IP3in (dBm) -5
21 (dB)
IP3out (dBm) 10
15 IP3in
10 IP3out
5 5
-10
0 10-3
10-2
IC (mA)
10-1
0 5 10 IS (mA)
-15 15
VS = VC = 3 V; PD = -30 dBm (both tones); f = 900 MHz; f = 100 kHz. f = 900 MHz; VS = 4 V; PD = -30 dBm.
Fig.6
Fig.5
Insertion gain as a function of control current; typical values.
Output and input 3rd order intercept point as a function of supply current; typical application; typical values.
2000 Dec 04
5
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
BGA2011
handbook, halfpage
2
MLD485
NF (dB) 1.6
1.2
0.8
0.4
0 5 10 IS (mA) 15
VS = VC = 3 V; f = 900 MHz.
Fig.7
Noise figure as a function of supply current; typical values.
Scattering parameters VS = VC = 3 V; PD = -30 dBm; Zo = 50 ; Tamb = 25 C f (MHz) 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 s11 MAGNITUDE (ratio) 0.553 0.499 0.394 0.331 0.295 0.276 0.267 0.262 0.270 0.287 0.309 0.339 0.360 0.390 0.398 0.392 ANGLE (deg) -22.45 -42.12 -71.44 -90.58 -104.0 -114.9 -124.2 -134.2 -144.2 -152.7 -159.7 -166.2 -172.0 -175.9 178.0 173.9 s21 MAGNITUDE (ratio) 16.198 14.354 10.688 8.156 6.512 5.415 4.640 4.112 3.659 3.336 3.045 2.849 2.680 2.511 2.332 2.108 ANGLE (deg) 160.5 145.4 124.6 112.2 103.9 97.72 93.01 89.10 85.21 82.21 78.21 73.94 69.19 64.60 59.20 56.72 s12 MAGNITUDE (ratio) 0.006 0.012 0.018 0.021 0.024 0.027 0.032 0.037 0.043 0.049 0.057 0.066 0.076 0.086 0.094 0.099 ANGLE (deg) 76.72 67.53 59.55 58.29 60.91 64.65 69.04 73.22 75.43 77.84 78.60 77.96 75.04 74.92 69.95 69.12 s22 MAGNITUDE (ratio) 0.115 0.184 0.256 0.283 0.293 0.298 0.304 0.310 0.311 0.309 0.312 0.304 0.291 0.292 0.278 0.317 ANGLE (deg) -87.98 -113.5 -141.2 -158.1 -170.5 178.7 169.5 162.5 157.0 152.7 150.5 149.6 151.4 149.2 148.4 140.0
2000 Dec 04
6
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
BGA2011
handbook, full pagewidth
90 +1 135 +0.5 +2 45 1.0 0.8 0.6 0.4 0.2 180 0 0.2 0.5 3 GHz 100 MHz -0.2 900 MHz -5 1 2 5 0 0
+0.2
+5
-0.5 -135 -1
-2
-45
MLD486
1.0
-90 IC = 15 mA; VS = VC = 3 V; PD = -30 dBm; Zo = 50 .
Fig.8 Common emitter input reflection coefficient (s11); typical values.
handbook, full pagewidth
90
135
45
500 MHz 100 MHz 900 MHz 1.8 GHz 3 GHz 0
20 180
16
12
8
4
-135
-45
-90 IC = 15 mA; VS = VC = 3 V; PD = -30 dBm; Zo = 50 .
MLD487
Fig.9 Common emitter forward transmission coefficient (s21); typical values.
2000 Dec 04
7
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
BGA2011
handbook, full pagewidth
90
135
45
3 GHz 20 180 100 MHz 16 12 8 4 0
-135
-45
-90 IC = 15 mA; VS = VC = 3 V; PD = -30 dBm; Zo = 50 .
MLD488
Fig.10 Common emitter reverse transmission coefficient (s12); typical values.
handbook, full pagewidth
90 +1 135 +0.5 +2 45 1.0 0.8 0.6 0.4 0.2 2 100 MHz -5 5 0 900 MHz 0
+0.2 3 GHz 180 0 0.2 0.5 1
+5
-0.2
-0.5 -135 -1
-2
-45
MLD489
1.0
-90 IC = 15 mA; VS = VC = 3 V; PD = -30 dBm; Zo = 50 .
Fig.11 Common emitter output reflection coefficient (s22); typical values.
2000 Dec 04
8
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
PACKAGE OUTLINE Plastic surface mounted package; 6 leads
BGA2011
SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2000 Dec 04
9
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
BGA2011
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified
2000 Dec 04
10
Philips Semiconductors
Product specification
900 MHz high linear low noise amplifier
NOTES
BGA2011
2000 Dec 04
11
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613516/02/pp12
Date of release: 2000
Dec 04
Document order number:
9397 750 07678


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